Soldering Basic Operation Manual

Quick reference guide for soldering basics: required tools, procedures, tips, and troubleshooting.

Soldering Basic Operation Manual

Required Tools

Basic Set

ToolDescriptionRecommended Product
Soldering IronTemperature-controlled (30W+) essentialgoot Temperature Controlled Soldering Iron PX-280
Iron StandEssential for burn and fire preventiongoot Iron Stand ST27
SolderLead-free, 0.6mm diameter for beginnersHAKKO Lead-Free Solder 0.6mm
FluxImproves solder flowHAKKO Lead-Free Flux FS200-01
Solder WickRemoves failed solder. 2-3mm widthHAKKO Solder Wick FR551-2515-J
NippersCuts excess component leadsWORKPRO Thin Blade Nippers

Additional Useful Tools

ToolDescriptionRecommended Product
TweezersHolding and positioning small componentsgoot Precision Tweezers TS-15
MultimeterContinuity check after solderingAstroAI DM6000AR
Wire StripperStrips wire insulationVESSEL Wire Stripper 3500E-3
Masking TapeTemporarily secures components3M Masking Tape M40J-15

Basic Procedure

STEP 1: Preheat Soldering Iron

  • Preheat for 2-3 minutes
  • Temperature setting: 320-350°C (350-380°C for lead-free)
  • Tip is ready when it shines silver

⚠️ Don’t work where air conditioning or fan airflow directly hits

STEP 2: Secure PCB and Components

  • Place components and temporarily secure with masking tape
  • Component leads should extend slightly through the PCB

STEP 3: Clean the Tip

  • Sponge type: Wipe tip with slightly damp sponge
  • Wire type: Insert into wire to remove residue

⚠️ Oxidized (black) tip will cause solder to be repelled

STEP 4: Apply Flux

  • Apply small amount to pad and lead
  • Work quickly after application (flux evaporates)
  • Always close lid after use

STEP 5: Heat Pad and Lead (Most Important)

  1. Angle the tip (30-45 degrees)
  2. Heat both pad and lead simultaneously
  3. Heat for 3-4 seconds

Tip: Angling the tip increases contact area and transfers heat efficiently

STEP 6: Melt and Flow Solder

  1. Apply solder to pad and lead junction (not to the tip)
  2. When solder forms Mt. Fuji shape, remove solder first
  3. Wait 1-2 seconds, then quickly remove iron

⚠️ Removing slowly creates “horns”

STEP 7: Cool, Inspect, and Trim Leads

  • Wait 5-10 seconds for solder to solidify
  • Cut excess leads with nippers (1-2mm above solder joint)

Check Points:

  • Is it Mt. Fuji shaped?
  • Is surface smooth and shiny?
  • Is solder attached to both pad and lead?

STEP 8: Continuity Check

  • Check connections with multimeter continuity mode
  • Buzzer sound means normal connection
  • Focus on power lines and GND

10 Tips for Success

#TipDetails
1Preheat iron sufficientlyWait at least 2-3 minutes
2Keep tip cleanClean frequently with cleaner
3Angle the tipIncrease contact area for efficient heating
4Heat pad and lead sufficientlyMaintain 3-4 second heating time
5Use appropriate amount of solderJust enough to cover the pad
6Remove iron quicklySlow removal creates horns
7Don’t move until solidifiedWait 5-10 seconds
8Work away from airflowAvoid AC and fan airflow
9Use flux liberallyReapply if solder is repelled
10Redo if failedRemove with wick and retry

Identifying Good Solder Joints

Good Examples

FeatureDescription
Mt. Fuji shapeSmooth, gradual slope
Smooth surfaceShiny, no bubbles or cracks
Good wetting on bothCovers entire pad and wets lead

Bad Examples

FailureAppearanceCause
Cold jointBall-shaped, not adhering to padInsufficient heating
Lifted leadOnly pad has solder, lead floatingLead not heated enough
BridgeMultiple pads connectedToo much solder
Horn/spikePointed tipIron removed too slowly

Troubleshooting

Solder Removal Method

  1. Cut solder wick to appropriate length
  2. Place wick on solder to remove
  3. Press iron on top of wick
  4. When solder is absorbed, remove both wick and iron together
  5. Discard used portion of wick

Common Problems and Solutions

ProblemCauseSolution
Solder repelledOxidized tip, insufficient fluxClean tip, apply flux
Solder won’t flowTemperature too low, insufficient heatingIncrease temp (to 350°C), extend heating time
Bridge formedToo much solderRemove excess with solder wick
Cold jointInsufficient heating, moved before solidifiedExtend heating time, wait for solidification
Tip turned blackOxidationReplace tip

Safety Precautions

ItemPrecaution
Burn PreventionTip and solder are 300°C+. Never touch with bare hands. Don’t touch for 10+ minutes after use
VentilationSolder smoke (flux vapor) is produced. Use exhaust fan or open window
Fire PreventionAlways place on stand. Keep away from flammables. Turn off after use
Eye ProtectionSolder can splash. Consider wearing safety glasses

Lead-Free vs Leaded Solder

ItemLead-Free SolderLeaded Solder
Melting Point~217-227°C (higher)~183°C (lower)
Working Temp350-380°C320-350°C
DifficultySlightly harderEasier for beginners
SafetyNon-toxicLead is toxic. Handle with care
Use CaseCommercial products, general electronicsHobby, personal use

Recommended for Beginners: Lead-free solder (current standard, safer)

Tips for Lead-Free Solder

  • Set temperature to 350-380°C
  • Heat slightly longer (4-5 seconds)
  • Use flux liberally
  • Ensure adequate ventilation